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SMT, through-hole, and mixed assembly under one roof. Fine-pitch BGA, QFN and LGA down to 0.4 mm, placed and inspected with AOI, X-ray and ICT. Quick-turn from 5-piece prototypes to 100k production runs, on the same line.
Assembly, inspection and test under one roof. The same team that builds the prototype builds the production run — contract manufacturing since 2009.
High-speed pick-and-place with 0.4 mm fine-pitch capability. Lead-free and leaded reflow.
Wave, selective and hand soldering for connectors, transformers and through-hole parts.
Automated optical inspection on every board. X-ray on BGAs and QFNs. ICT and flying probe on request.
Custom test fixtures and firmware-driven functional test, designed and built in-house.
A four-stage assembly flow with traceability at every step.
BOM scrubbed, components sourced or kitted, and DFM checked against assembly capability.
Stencil printed, parts placed, reflowed. Inline AOI catches defects before the board moves on.
Through-hole soldered, BGAs X-rayed, ICT or flying-probe testing on every unit when required.
Firmware loaded, functional test run, units serialized, packed and shipped.
Common specs and quality benchmarks we run to.
| Parameter | What we run to |
|---|---|
| Volume | 5-piece prototype to 100,000+ unit production |
| Component pitch | 0.4 mm BGA, QFN, LGA. 01005 passives on capable lines |
| Board size | 20 x 20 mm to 460 x 510 mm |
| Inspection | 100% AOI, X-ray on BGA, optional ICT and flying probe |
| Standards | ISO 9001:2015, IPC-A-610 Class 2 and Class 3 |
The same engineers who place the first prototype run the production line. A few of the products we have taken to volume.
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Capability, MOQ and what to expect on a Jaycon engagement.
There is no MOQ. We assemble 5-piece prototypes on the same lines that run our 50,000-unit production jobs. Lead time is the same regardless of volume.
Either. Full turnkey sourcing through our distributor network, or you ship a consigned kit. Hybrid jobs (you supply the long-lead parts) are routine.
Yes. 0.4 mm pitch BGA, QFN and LGA are placed daily. Every BGA is X-ray inspected and the report ships with the order.
ISO 9001:2015 certified. We build to IPC-A-610 Class 2 by default and Class 3 on request for medical, aerospace and industrial customers.
From product design and PCB layout to rapid prototyping and high-volume injection molding.
Concept to prototype with a user-centered approach.
How we design products →Custom electronic solutions, prototyping to mass production.
Our PCB services →Schematic capture and layout engineered for manufacturability.
How we design boards →Rapid iteration with multiple technologies and fast turnaround.
How we prototype ideas →