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PCB design, PCBA, box build, test and supply chain under one roof. We serve industrial automation, telco, IoT, medical and OEM electronics programs from prototype to high-volume production.
An integrated electronics manufacturer: design, assembly, enclosures, test and supply chain, all in-house.
Schematic capture and PCB layout in Altium, KiCad and OrCAD, released DRC-clean and DFM-checked for our own line.
Pick-and-place down to 0201 passives, 0.4 mm-pitch BGA, QFN and LGA, plus through-hole, press-fit and mixed assembly.
Cable harnesses, sub-assemblies, enclosure integration and final pack-out, with sourcing and allocation risk managed for you.
100% AOI, X-ray on every BGA, ICT, functional test and burn-in, all IPC-A-610 and ISO 9001:2015 documented, from pilot to volume.
Four phases for any electronics manufacturing program, run by one accountable team.
Free DFM review on every program. Itemized quote within 48 hours from your Gerbers and BOM.
First-article assembly, fixture build and pilot run. Issues are caught before volume ramps.
Volume SMT, THT and box-build, with test and QA documentation delivered per program.
Engineering changes, BOM updates and lifecycle management keep the line running as your product evolves.
Every capability of our line, mapped to the deliverable it produces.
Schematic, PCB layout, Gerbers, IPC-2581 and DFM report
Populated boards down to 0201 passives and 0.4 mm-pitch BGA/QFN/LGA
Cable harnesses, sub-assemblies, enclosure integration and pack-out
100% AOI, X-ray on every BGA, ICT, functional test and burn-in reports
Authorized sourcing, allocation management and EOL alternates
10 to 100,000+ boards per program, 1 to 12-layer rigid, flex and rigid-flex
ISO 9001:2015, IPC-A-610 Class 2 and 3
Send us the design and BOM and our team walks the build before the line runs. Footprints, testability, and sourcing flagged so first-pass yield holds at volume.
Footprints, spacing, and paste checked so SMT and through-hole run clean.
ICT, flying-probe, and functional test planned for real fault coverage.
Lifecycle, second-source, and lead-time risk flagged before you commit.
Inspection and test picked for fault coverage, speed, and volume, so defects are caught before they ship. Here is how the common methods compare.
Ratings are a general guide. Most builds pair AOI with ICT or functional test. The mix is confirmed with your coverage and volume goals during the DFM & test review.
Process, scope and what to expect when you start an electronics program with Jaycon.
From 10-unit prototypes to 100,000+ unit production runs. The same engineers manage both, so the NPI-to-production transition is internal.
Yes. ISO 9001:2015 across our manufacturing sites.
Yes. We source through authorized distributors, manage allocation risk, and offer alternates when a part goes EOL or hits long lead times.
Yes. Cable harnesses, sub-assemblies, enclosure integration and retail-ready pack-out are all in scope. We ship direct to your warehouse or 3PL.
From product design and rapid prototyping to precision injection molding and circuit board manufacturing.
We take your idea from sketch to working prototype, with a team that handles both the look and the engineering.
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Custom PCB design and assembly, reviewed by engineers before production so nothing gets built twice.
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Get a physical part in your hands fast. We use the right technology for your design so you can test and move forward.
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When you are ready to scale, we handle the tooling and run production so you can focus on your business.
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