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PCB design, schematic to fab.

★★★★★ 4.9 Rated on Google Inc. 5000 honoree · ISO 9001:2015

Schematics and layouts that pass DFM the first time. Schematic capture, multi-layer layout, and a manufacturing pack fab loves — with an itemized quote and DFM review in under 24 hours.

  • 1 to 12 layers, HDI on request
  • Controlled impedance & length matching
  • Signal & power integrity checked
  • Altium, KiCad, Eagle, OrCAD
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What we deliver

Design files that fab loves.

A clean release pack: schematic, layout, manufacturing data, and a BOM the assembly line can build to.

Isometric illustration of a schematic capture with ERC clean check

Schematic capture

Hierarchical schematics, full annotation, ERC clean. Native Altium, KiCad, Eagle, or OrCAD.

Isometric illustration of an exploded multi-layer PCB stack-up

Multi-layer layout

1 to 12 layers, controlled impedance, length matching, and HDI when the design demands it.

Isometric illustration of signal and power integrity simulation on a PCB

SI & PI checks

Signal- and power-integrity simulation on critical nets. Decoupling and stack-up reviewed.

Isometric illustration of a PCB manufacturing release pack

Manufacturing pack

Gerbers, drill files, IPC-2581, pick-and-place, BOM, fab and assembly drawings.

How we work

A PCB release process that works.

Four stages with a review at every gate. No surprises at fab.

01

Spec & stack-up

Signal classes, impedance targets, layer count, and material picks documented before layout starts.

02

Schematic capture

Hierarchical schematic, library review, and ERC clean release to layout.

03

Layout & routing

Constraint-driven routing, length matching, and pour-fill review. DRC clean throughout.

04

Release & DFM

Manufacturing data generated and reviewed against fab capability. Released to fab and assembly.

Design parameters

Built to the right specs.

Layers
Up to 24 layers
Min Trace / Space
0.075 mm / 0.075 mm (3 mil / 3 mil)
Min Hole
0.20 mm (8 mil) finished
Via Types
Blind / Buried / Microvia / Stacked
Impedance Control
Single-ended & Differential
High-Speed Support
DDR, PCIe, USB, HDMI, Ethernet, and more
Board Thickness
0.4 mm to 3.2 mm
Surface Finish
HASL, ENIG, OSP, Immersion Silver, and more
Standards
IPC-2221, IPC-6012 Class 2 & 3
Multi-layer blue PCB showing controlled-impedance routing and fine-pitch footprints
FAQ

Common questions about PCB design.

Tools, capability, and what to expect on a Jaycon engagement.

Which EDA tools do you work in?

Altium Designer is our primary EDA tool. We also work in KiCad, Autodesk Eagle, OrCAD, and Allegro, and deliver native files plus neutral Gerbers and IPC-2581.

Do you handle high-speed and HDI designs?

Yes. DDR, USB 3, PCIe, and 10G Ethernet are routine. HDI stacks with microvias and via-in-pad are part of our standard toolkit.

Can you take a schematic and just do the layout?

Yes. Layout-only engagements are fine. We start with a schematic and constraint review, then deliver a DFM-clean board.

Is uploaded design data protected?

All file uploads run through an NDA before review. NDAs are signed before any technical discussion and data lives on access-controlled servers.

Ready to design your PCB?

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